- 地点
- 上海,中国
- 资历
- senior
职责
- 嵌入式固件和驱动程序开发:设计、开发、调试和优化低级固件、BSP(板卡支持包)和设备驱动程序,以支持内部芯片功能,如网络交换、MAC、PHY 和各种外设控制器。
- 汽车网络协议栈实现:开发、移植和集成关键的汽车网络协议栈,例如汽车以太网 IEEE 802.3bw(100BASE-T1)/ IEEE 802.3bp(1000BASE-T1)/ IEEE 802.3cg(10BASE-T1S)等;更高层协议 TCP/IP、UDP、SOME/IP、DoIP 和 AVB/TSN 协议套件。
- 跨职能协作开发:在前端(RTL 设计)和后端(验证)阶段与芯片设计团队密切合作;参与芯片架构定义,提供面向软件的见解,并开发用于芯片验证的固件工具。
- 应用工程支持:与应用工程(AE)团队合作,为重点客户提供深度技术支持,解决与芯片集成和软件开发相关的复杂问题;开发参考设计和演示固件以展示芯片功能。
- 全生命周期开发:参与整个软件开发生命周期,包括需求分析、设计、编码、单元测试、系统集成和验证。
- 技术文档:创建详细的设计文档、API 指南、应用说明和测试报告。
必备要求
- 计算机科学、电子工程、通信工程或相关领域的学士或硕士学位。
- 3-5 年嵌入式软件开发经验。
- 熟练掌握资源受限嵌入式环境的 C/C++ 编程,并掌握编码标准和软件工程最佳实践。
- 深入了解微控制器/微处理器架构(主要是 ARM Cortex-A/R/M 系列)。
- 对汽车网络技术有深入的了解,拥有汽车以太网的项目经验。
- 熟悉常见的硬件接口和调试工具(例如 SPI、I2C、UART),在嵌入式固件应用中进行验证和故障排除的实践经验。
- 出色的调试和解决问题的能力,能够使用示波器和逻辑分析仪执行硬件/软件协同调试。
- 具有与芯片设计/验证团队合作的经验,并对数字设计概念(例如寄存器配置、中断处理、DMA)有基本的了解。
- 良好的英语读写能力,能够用英文报告工作、阅读文章和起草文件。
- 责任心强,沟通能力出色,具有协作的团队精神。
优先条件
- 具有汽车电子软件开发经验,熟悉 ASPICE 流程和 ISO 26262 等功能安全标准。
- 具有 AUTOSAR 架构经验,特别是具有通信堆栈(COM Stack)或网络管理(NM)知识;了解汽车诊断协议(例如 UDS、DoIP)。
- 良好的英语口语。
Responsibilities
- Embedded firmware and driver development: design, develop, debug and optimize low-level firmware, BSP (board support package) and device drivers to support internal chip functions such as network switching, MAC, PHY and various peripheral controllers.
- Automotive network protocol stack implementation: develop, port and integrate critical automotive network protocol stacks, e.g. automotive Ethernet IEEE 802.3bw (100BASE-T1) / IEEE 802.3bp (1000BASE-T1) / IEEE 802.3cg (10BASE-T1S); higher-layer protocols TCP/IP, UDP, SOME/IP, DoIP and AVB/TSN protocol suites.
- Cross-functional collaboration: work closely with chip design teams during front-end (RTL design) and back-end (verification); participate in chip architecture definition, provide software-oriented insights, and develop firmware tools for chip verification.
- Application engineering support: collaborate with Application Engineering (AE) teams to provide in-depth technical support to key customers, solving complex issues related to chip integration and software development; develop reference designs and demo firmware to showcase chip capabilities.
- Full lifecycle development: participate in the entire software development lifecycle, including requirements analysis, design, coding, unit testing, system integration and verification.
- Technical documentation: create detailed design documents, API guides, application notes and test reports.
Must Have
- Bachelor's or Master's degree in Computer Science, Electronic Engineering, Communication Engineering or related fields.
- 3-5 years of embedded software development experience.
- Proficiency in C/C++ programming for resource-constrained embedded environments, with coding standards and software engineering best practices.
- In-depth understanding of microcontroller/microprocessor architectures (mainly ARM Cortex-A/R/M series).
- Deep knowledge of automotive networking technologies; project experience with automotive Ethernet.
- Familiarity with common hardware interfaces and debugging tools (e.g. SPI, I2C, UART); hands-on experience in validation and troubleshooting in embedded firmware applications.
- Excellent debugging and problem-solving skills; ability to perform hardware/software co-debugging using oscilloscopes and logic analyzers.
- Experience working with chip design/verification teams and basic understanding of digital design concepts (e.g. register configuration, interrupt handling, DMA).
- Good English reading and writing skills; ability to report work, read articles and draft documents in English.
- Strong sense of responsibility, excellent communication skills and collaborative team spirit.
Preferred
- Experience in automotive electronics software development, familiar with ASPICE process and functional safety standards such as ISO 26262.
- Experience with AUTOSAR architecture, especially communication stack (COM Stack) or network management (NM) knowledge; understanding of automotive diagnostic protocols (e.g. UDS, DoIP).
- Good spoken English.
公司简介
Monolithic Power Systems, Inc.(MPS)是半导体行业发展最快的公司之一,是集成功率半导体和系统供电架构的全球技术领导者。MPS 培养创造力,对可持续发展充满热情,致力于为客户提供领先的产品和创新。其技术组合有助于为世界提供动力。