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触觉传感器嵌入式软件开发工程师(实习生)

Tactile Sensor Embedded Software Development Engineer (Intern)

上海大裂谷智能科技有限公司(Sharpa Robotics)

地点
上海,中国
类型
实习

机器人工业机器人

职责

  • 开发实时高性能嵌入式软件,包括定制中间件、驱动程序和应用程序功能模块;负责机器人传感器(应变片式单点/六维力传感器)固件开发,实现高精度力/力矩数据采集。
  • 主导嵌入式平台软件架构设计、开发与优化,把控产品固件全生命周期研发;设计信号调理与数字滤波算法(滑动平均/IIR/中值滤波),处理应变片原始信号的噪声、温漂与蠕变;从模块化、可扩展性、可维护性角度规划固件架构。
  • 开发自动化测试,确保发布高质量软件和准确功能;设计传感器出厂多点校准固件,实现零点校准、加载校准、温度补偿表写入及一致性验证;负责OTA升级方案设计与实现,包括固件差分/整包升级、回滚机制、升级安全校验(加密/签名)及断点续传。
  • 与硬件和系统团队密切合作,明确系统要求,参与电子硬件方案评审;协同硬件工程师完成高速通电路、仪表放大器(INA)与ADC之间的信号链路设计,分析并优化PCB噪声;负责传感器与上位机(机器人主控/ROS节点)之间的通信协议设计与定义,保证数据交互的高可靠性、低延迟及可扩展性。
  • 负责ADC信号采集与处理:包括多通道ADC时序配置、DMA传输设计与优化、采样率与分辨率权衡;实现信号预处理算法(如滑动平均、中值滤波、HR/IIR滤波),完成从原始AD值到物理力/力矩值的精准转换与标定。
  • 参与基于瑞芯微平台的嵌入式Linux开发:包括Linux字符设备驱动调试、I/O子系统应用、Socket网络通信编程,以及交叉编译环境下的应用层开发与调试。

必备要求

  • 计算机、电子、通信、仪器科学、生物医学工程等相关专业,本科及以上学历(实习生要求:在校大三/大四或研一/研二学生,可连续实习3个月以上)。
  • 掌握C语言编程,掌握MCU软件开发与调试技能;理解应变片传感器信号链路(敏感元件→电桥→INA→ADC→MCU),熟悉电桥平衡、差分放大原理。
  • 有基于STM32或类似ARM平台的项目开发经验,熟悉常用通信接口(CAN/I2C/SPI/UART/ETH等);熟练使用MCU片内/片外高精度ADC(≥16bit),掌握DMA多通道采样、过采样与抗混叠滤波技术,理解ENOB、采样率与信噪比的权衡。

Responsibilities

  • Develop real-time, high-performance embedded software, including custom middleware, drivers, and application function modules; responsible for firmware development of robotic sensors (strain gauge single-point/six-axis force sensors) to achieve high-precision force/torque data acquisition.
  • Lead embedded platform software architecture design, development, and optimization, and manage the full lifecycle of product firmware; design signal conditioning and digital filtering algorithms (moving average/IIR/median filter) to handle noise, temperature drift, and creep of raw strain gauge signals; plan firmware architecture from modularity, scalability, and maintainability perspectives.
  • Develop automated tests to ensure high-quality software releases and accurate functionality; design factory multi-point calibration firmware for sensors, implementing zero-point calibration, load calibration, temperature compensation table writing, and consistency verification; responsible for OTA upgrade solution design and implementation, including differential/full-package firmware upgrades, rollback mechanisms, upgrade security verification (encryption/signature), and resume from breakpoint.
  • Work closely with hardware and system teams to clarify system requirements and participate in electronic hardware design reviews; collaborate with hardware engineers on signal chain design between high-speed circuits, instrumentation amplifiers (INA), and ADCs, analyze and optimize PCB noise; responsible for communication protocol design and definition between sensors and host (robot main controller/ROS nodes) to ensure high reliability, low latency, and scalability of data exchange.
  • Responsible for ADC signal acquisition and processing: including multi-channel ADC timing configuration, DMA transfer design and optimization, sampling rate and resolution trade-offs; implement signal preprocessing algorithms (e.g., moving average, median filter, HR/IIR filter), and complete accurate conversion and calibration from raw AD values to physical force/torque values.
  • Participate in embedded Linux development based on Rockchip platform: including Linux character device driver debugging, I/O subsystem application, Socket network communication programming, and application-layer development and debugging in cross-compilation environments.

Must Have

  • Bachelor's degree or above in Computer Science, Electronics, Communications, Instrumentation Science, Biomedical Engineering, or related fields (intern requirements: current junior/senior undergraduate or first/second-year master's student, available for continuous internship of 3+ months).
  • Proficiency in C programming and MCU software development and debugging skills; understanding of strain gauge sensor signal chain (sensing element → bridge → INA → ADC → MCU), familiar with bridge balance and differential amplification principles.
  • Project development experience based on STM32 or similar ARM platforms, familiar with common communication interfaces (CAN/I2C/SPI/UART/ETH, etc.); proficient in using MCU on-chip/off-chip high-precision ADCs (≥16bit), mastering DMA multi-channel sampling, oversampling, and anti-aliasing filtering techniques, understanding trade-offs among ENOB, sampling rate, and signal-to-noise ratio.